CUHK ASIC Lab Chronicle
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2015年11月2日 星期一
[Packaging] Ball bond and Wedge bond
Review on two bonding processes.
Ball Bonding: High Speed, common process
Wedge Bonding: High Resolution, Fine pitch.
http://www.palomartechnologies
.com/blog/bid/206846/Ball-
Bonding-vs-Wedge-Bonding
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